English
IPC-9701 defines thermal cycling test methods for evaluating solder joint reliability. Superb uses IPC-9701 as the reference for thermal stress testing — -40°C to +125°C cycling, in-situ electrical monitoring, and post-cycle failure analysis.
IPC-7095 governs BGA design, placement, reflow profiling, void criteria, and X-ray inspection. Superb Automation achieves sub-5% BGA void rates — well below the IPC Class 3 requirement of under 30%.